Treatment for Skin Resurfacing CO2 Fractional Laser Machine Vertical Safe

Delivery Time:within 3-7 working days upon receipt of payment
Certification:Medical CE, ISO13485.free sales certification, etc

Treatment for Skin Resurfacing CO2 Fractional Laser Machine Vertical Safe

I.Theory

This technology is known as Fractional Photothermolysis theory (dot-matrix light and heat decomposition), the 10.6μm far-infrared laser will evenly mark with tiny holes, and then cause a series biochemical reactions inside the skin, thus to reach the results of skin lifting & resurfacing, pigments and scar removal, etc, finally let the skin return to young again.

II.Applications:

      1.    Skin renewing and resurfacing

      2.    Wrinkle removal, skin tightening

      3.    Acne and acne scar removal

      4.    Smooth burnt scars and surgery scars, etc

      5.    Remove intractable chloasmas and pigmentation

      6.    Sun damage recovery

III.Features:

1.  RF Coherent co2 fractional Laser(Safe, precise, and powerful fast treatment)

2. Individual design of laser structure, greatly facility laser replacement and easy daily manintenace

3. Display: 8.4\" color touch LCD screen

4. Humanized software control, stable laser output, more safety

5. Smart articular arm, high accuracy

6. Excellent performance, not affect people\'s normal life and study

7. Packing: aluminum alloy case

IV.Parameters:

Basic specification
Wavelength	10.6μm, far-infrared laser
Control	LCD 8.4 inch
Pulse frequency	33.3 Hz
Duration	0.1~10 ms
Distance	0.1~2.6 mm
Interval	0~6s
Repeat	1~5000ms
overlap	1~20 times
Average power	40W
Working mode:	Continuous pulse, single pulse, interval pulse
Scan Graphics	Square, rectangle, round, triangle, oval, 6-diamond shape, line
Dot quantity	400 dots at most
Working state	Hyper-pulsed mode
Scan mode	Sequence scan, Random scan, maximum distance scan
Pulse energy	10mj to 130mj is optional for each dot.
Technical specification
Condenser focus	f=50mm
Beam divergence angle	0.3 mrad
Spot size	0.1 mm
Aiming beam	Less than 2mW, 635nm red semiconductor laser
Cooling system	air cooling
Environment temperature	5-400C
Relative humidity	＜80%
Temperature in transit	-40-500C
Humidity in transit	＜85%
Beam transport device	Articulated arm with 7-joint and balance weight
Atmospheric pressure	86.0kpa-106.0kpa
Warming up time	2 min
Electromagnetic requirement