NPEL-128E Low-Chlorine Epoxy Resin for Electronics Encapsulation & High-End Applications

NPEL-128E is a high-purity liquid bisphenol-A epoxy resin specifically designed for demanding electronic and industrial applications. With a hydrolyzable chlorine content of ≤300 ppm, it significantly reduces the risk of circuit corrosion and insulation degradation caused by chlorine ion migration—making it an ideal material for high-reliability electronic packaging, integrated circuit protection, and precision adhesive applications.

Key Technical Characteristics:

• Epoxy Equivalent Weight: 184–190 g/eq
• Viscosity (25°C): 12,000–15,000 cps
• Gardner Color: 0.0–1.0 (nearly colorless)
• Hydrolyzable Chlorine: ≤300 ppm
• Appearance: Clear, transparent liquid

Performance & Applications:
NPEL-128E demonstrates excellent mechanical strength, thermal resistance, and chemical stability after curing with polyamine or polyamide hardeners. It is widely used in:

• IC & LED encapsulation
• PCB conformal coatings and substrate materials
• Structural adhesives for electronics and optics
• High-performance composite matrices and corrosion-resistant coatings
• Molding resins and tooling applications

Storage & Handling:
When stored sealed at room temperature, NPEL-128E remains stable for up to 12 months. If crystallization or haziness occurs, gentle heating to 50–60°C with stirring will restore its original liquid state without affecting performance.

Safety Note:
Avoid direct contact with skin and eyes. In case of contact, rinse thoroughly with water and seek medical attention if necessary.

Designed for reliability, purity, and process versatility, NPEL-128E provides a trusted material solution for advanced manufacturing in electronics, automotive, aerospace, and specialty industrial sectors.