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6 inch As Cut Silicon Carbide Wafer Supplier For SiC diamond grinding
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Basic Info
| Diameter | 150mm | ||||
|---|---|---|---|---|---|
Product Description
6 inch As Cut Silicon Carbide Wafer Supplier For SiC diamond grinding
As the professional unprocessed SiC wafer Manufacturer and supplier, HMT use wafer cassette package raw cut Wafer and delivered to customers via Internation express We can provide 2 inch 1200um, 4 inch 600um 6 inch 900um etc. and support customized. Without lapping and polishing Sic Wafer can be applied for diamond grinding wheel, abrasives testing, newest lapping technology texting....
Compared with silicon (Si), SiC (SiC) base material has significant performance advantages, especially in high pressure and high frequency performance.SiC (SiC) semiconductor is the most mature one among the wide band gap semiconductors developed. SiC semiconductor materials have a wide band gap, high breakdown electric field, high thermal conductivity, high saturation electron mobility and smaller volume, etc., which has great application potential in high temperature, high frequency, high power, optoelectronics and radiation resistance devices.
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