3D Vapor Chamber(3DVC)-300*110*9*H60mm

Substrate size: 300 x 110 x 9

Heat pipe size: D8*L60*N36

Power: 900W

Heat flux density: 152(W/cm2)

Heat source size: 25*25mm

Application Industry: Server

3D Vapor Chamber (3DVC) is a three-dimensional structure that combines the advantages of a vapor chamber and a heat pipe, capable of transferring heat to any corner. The internal cavities of the heat pipe and the heat plate are interconnected, along with the capillary wick, expanding the steam space and facilitating the rapid return of liquid to the evaporation end. This design enables heat conduction in three dimensions. In comparison to heat pipes and flat vapor chambers, 3D Vapor Chamber (3DVC) offers higher power and lower thermal resistance.

3D temperature plates (3DVC) can be customized.

Maximum size: 400 x 300 mm;

Tube length: 30-300 mm;

Tube structure: bendable and flattened;

Maximum power: 1500W

3DVC Heat Sink

POWER(W) Tc (°C) Ta (°C) AT (°C) R (°C/W)

115 39.5 25.2 14.3 0.124

165 45.3 25.1 20.2 0.122

215 51.1 25.4 25.7 0.120

265 57 25.6 31 .4 0.118

315 62.5 25.4 37.1 0.118

365 68 25.6 42.4 0.116

HP Heat Sink

POWER(W) Tc (°C) Ta (°C) AT (°C) R (C/W)

115 46 25 21 0.183

165 54.3 24.9 29.4 0.178

215 62.8 25.1 37.7 0.175

265 69.4 25.1 44.3 0.167

310 81.1 25.1 56 0.181

E. Thickness of the heat plate F. Length of the ineffective end of the heat pipe G. Height of the flange at the connection between the heat plate and the heat pipe

Copper tube diameter Min. A Min. B Min. C Min. D Min. E Min. F Min.G

（mm） （mm） （mm） （mm） （mm） （mm） （mm） （mm）

6 13 13 34 16 3.2 6 3

8 14 14 36 18 3.2 8 3

10 15 15 38 20 3.2 8 3

12 16 16 40 22 3.2 10 3