Custom Liquid Cooling Plates for Advanced Electronic Applications

Intel CPU X3 liquid cooling plate

The unique heat dissipation design cleverly directs the water cooling liquid to

the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and

heat dissipation performance. Its unique flow path design ensures that the

coolant can flow efficiently.Evenly distributed on each heat dissipation surface,

thereby significantly improving heat dissipation efficiency. Compared with

traditional heat dissipation methods.Heat sinks and fans enhance heat

dissipation more effectively.

Small batch customization with quick proofing

》Efficient heat dissipation, solid structure, and optimized thermal management.

》Performance is improved. After using the liquid cooling plate, the failure rate

caused by CPU overheating is reduced by 50%.

》Runner processing, brazing packaging

》anodizing.

》Can be customized according to customer conditions.

Model ：T-HS202302 Category：Intel CPU

Welding process：pure copper TLP welding heat source Total power：270W

Working environment：45°C,1LPM,45%PGW cold plate surface temperature：below 56°C

flow resistance：Below 1.5KPa Resistant to stress：1Mpa