CPC Series Advancing the Frontiers of Composite Polymer Technology

CMC, S-CMC, HS-CMC series

CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum's low thermal expansion coefficient and copper's high thermal conductivity. The surface is covered with oxygen-free copper plates, eliminating the need to worry about airtightness. Additionally, the copper-coated surface facilitates electroplating. S-CMC is a multi-layer CMC with better symmetry. HS-CMC is a multi-layer composite sheet with holes in the core molybdenum plate. The central core hole is filled with oxygen-free copper, enhancing thermal conductivity in the Z direction. This unique variety was developed by our company in collaboration with Kyocera for 5G power devices.

Our Ceramic Matrix Composite (CMC) can be stamped into sheet parts and even made into multi-boss heat pipe products. The layer thickness ratio of CMC series materials can be adjusted arbitrarily to obtain different thermal expansion coefficients.