Cost-Effective Liquid Cooling Plate Solutions for Electronic Devices

IGBT liquid cooling plate

The unique heat dissipation design cleverly directs the water cooling liquid to

the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and

heat dissipation performance. Its unique flow path design ensures that the

coolant can flow efficiently.Evenly distributed on each heat dissipation surface,

thereby significantly improving heat dissipation efficiency. Compared with

traditional heat dissipation methods.Heat sinks and fans enhance heat

dissipation more effectively.

Small batch customization with quick proofing

》Efficient heat dissipation and noise control.

》Higher performance and extended graphics card life.

》Compatible with, and manufactured from highly thermally conductive

materials such as copper and aluminum.

》Easy to install.

》Seamless and perfect joint, no worries about leakage.

Model ：T-HS202313 Category：High power IGBT

Welding process：Aluminum alloy Vacuum brazing heat source Total power：10KW

Working environment：38°C, 20LPM, 纯水 cold plate surface temperature：below56°C

flow resistance：Below50KPa Resistant to stress：1Mpa